Master in Microelectronics Technology and Manufacturing Management
Module 2.4 - CMOS Technologies
2.4.1 - CMOS Technology & Process Architecture
Program focus
This 2-days course presents how the individual processes (cleaning, furnace,
lithography, etch, CVD, CMP, implantation, RTP, PVD, etc...) previously
studied in this Master are combined in order to build the process flow of
a given technology.
Basic MOS transistors and floating gate memory devices will be described,
from a layout point of view until each process step required for their
fabrication, introducing the dimensional aspect linked to a given technology.
Focus will be given on critical modules such as isolation, gate definition,
PMD, interconnects, etc… Also, this course will give some examples
of electrical impacts some process step may have on the final product.
Benefits
At the end of the course, you will understand and better evaluate the parameters
taken in account in the fabrication of integrated circuits making the link
between layout, design rules, mask sequence and process steps. You will
learn how can one single process step deviation of a technology play an
important role in devices characteristics.
2.4.2 - BiCMOS Technology
Program focus
The 12-hour course deals with the fundamentals and the evolution of BiCMOS
technologies, which join CMOS, the dominant integrated circuit technology,
with BIPOLAR, which adds further advantages of high speed, precision and
current driving capability. BiCMOS technologies, first adopted to boost
digital applications, have become a successful platform for high-performance
mixed signal applications.
The course introduces the basic BiCMOS technology, emphasizing the complex
and mutually interdependent processing steps that must be performed in a
well-defined and planned sequence in order to assure optimal performance
and yield at an acceptable cost. The challenges, requirements and options
associated with BICMOS technologies are reviewed and discussed in detail
through some examples of ST advanced BICMOS processes. Finally, the last
section is devoted to the high quality passive components, which complete
the BiCMOS platform for SoC applications.
Benefits
At the end of this course, you will be able to accompany the development
of a properly integrated and engineered technological process.
2.4.3 - Application to imagers
Program focus
A 3 hours course describing the CMOS imager process technology and pixel
architecture
Benefits
After this session you should have a clear understanding of modifications
of the CMOS process required to enhance the pixel performances. You should
also understand the basic architecture and functioning of the CMOS pixel.