Master in Microelectronics Technology and Manufacturing Management
Module 3.4 - Physical Characterization Tool
Detail
3.4.1 - Basic Physics Phenomena
3.4.2 - Electrical
& Physical Characterization Tools and analysis
3.4.1 - Basic Physics Phenomena
Program focus
The purpose of this twelve-hour course is to acquire theoretical knowledge
of various fields in physics and chemistry, required to easily understand
the several characterization techniques in the semiconductor industry.
Benefits
At the end of the course, you will understand the major theoretical aspects
used within the different characterization techniques and tools.
3.4.2 - Electrical & Physical Characterization Tools and analysis
Program focus
This three days module presents the challenges of Electrical and physical
analysis involved with CMOS technologies development, product design and
production monitoring.
The purpose of this module is to acquire some knowledge about analysis performed
by CMOS technologies laboratory considering monitoring/control mission but
also failure analysis mission to support development and problem solving.
This module will give a description of tools and methodologies used to validate,
localize, observe and characterize defects or structures in integrated circuit.
At the end of this module, you will be able to
- Understand electrical, physical and chemical analysis techniques involved in monitoring and failure analysis
- Choose the right techniques to analyze/observe defects/structures
- Know the limitations of each techniques and the challenges for the future
Benefits
At the end of this module,
- You will know the different analysis techniques, and you will be able
to define action plan taking into account lab capability to solve your potential
scraps, yield loss, test rejects, design bug or customer returns issues
- You will have a better understanding of the failure analysis or physical/chemical
analysis reports