Master in Microelectronics Technology and Manufacturing Management
Module 2.3 - Process Steps
Detail
2.3.1 - Plasma Etching Physics
2.3.2 - Plasma Etching Application
2.3.4 - Copper Interconnect: Fundamental & Technology aspects
2.3.1 - Plasma Etching Physics
Program focus
This six-hour lecture discusses the fundamental principle of plasma etching.
It is an introduction to basic plasma physics, in order to understand how
plasma reactors etch silicon or silicon oxide. It answer the question, what
are plasma parameters to control plasma chemistry in industrial reactors?
Benefits
basics physics about plasma reactors will be presented, different kind of
reactors will be study and then, at the end of this lecture, students will
be able to control all kind of plasma process (etching and deposit)
2.3.2 -Plasma Etching Application
Program focus
This six-hour course provides an introduction to plasma physics. New concepts
are didactically developed to give a general view about plasma physics,
plasma reactors and plasma measurements.
The background physics developed here will be followed by an overview of
plasma applications (etching, PECVD…).
Benefits
At the end of this lecture, you will understand the basic physics of a plasma,
but also what is the matter in the edge of the plasma, and what are all
the exchanges (ions, electrons, and neutral) between surface and plasma.
You will be able to use most of the scientific terms of the industry, and
will develop your own scientific feeling in order to control a plasma process.
2.3.3 - Heat Treatments
Program focus
This 12-hour course will give an overview of mass transport phenomena and
phase transformation occurring during processing or use of IC. This includes
classical diffusion (e.g. doping diffusion), diffusion under external fields
(electro migration), reactive diffusion (oxidation, silicidation) and their
possible interactions (doping redistribution, defect injections...).
Benefits
At the end of this course, you will have a good level of understanding of
the major steps of IC fabrication involving heat treatments and mass transport.
You will get the basic knowledge and practical tools necessary to allow
critical use of process models such as Suprem.
2.3.4 - Copper Interconnect: Fundamental & Technology aspects
Program focus
Cu interconnect technology continues to evolve. The aim of this 6-hour class
is to provide the basic knowledge of the principal challenges linked to
the development of a Cu interconnect technology, as well as to present to
date achievements and current technology.
In a first part, we review the thermodynamic and kinetic properties of Cu
in materials involved in Si technology, in order to understand the technical
problems met for production of ICs using Cu interconnects. In a second part,
the ongoing development of Cu interconnect technology is reviewed (Cu deposition
and patterning, nature of the dielectric, cleaning, barriers, etc.), and
the current Cu technology used in production is presented.
Benefits
At the end of the course, the student will be able to understand the technical
problems faced for production of ICs using Cu interconnects, and will be
aware of the current Cu interconnect technology (materials and methods of
fabrication) as well as of the ongoing research and developments.
2.3.5 - Lithography
Program focus
The goal of this 9 hours course is to provide an overview of optical lithography
as used in semiconductor industry to manufacture wafers. All the steps needed
to perform a full lithography cycle will be addressed. Future trends to
keep industry on track with the Moore’s law will also be briefly discussed.
Benefits
At the end of the course, the participants should be able to identify, analyse
and properly address the issues determining the performance on wafer of
each lithography step. An understanding of the business environment is also
attained.
2.3.8 - Ion Implantation
Program focus
This six-hour course covers ionic implantation techniques.
Benefits
At the end of this course, you will have a precise understanding and overview
of what an ion implanter is and how it works.
2.3.9 - Wafer Cleaning & wet Processing
Program focus
This six-hour lecture discusses the basic principles of wet cleaning. Reference
is made to contamination types, contamination removal, the physics and chemistry
of cleaning and the main cleaning and etching processes. Comparison with
process requirements is constantly made.
Benefits
At the end of this lecture, you will know the basics of wet cleaning: no
black magic, but a rational application of basic physics and chemistry.