Master in Microelectronics Technology and Manufacturing Management
Module 1.2 - Quality system
Detail
1.2.1 - Quality systems and tools
1.2.2 - Wafer level Reliability
1.2.3 - Device & Oxide Reliability
1.2.5 - Failure Mode & Effect Analysis
1.2.1 - Quality systems and tools
Program focus
This nine-hour module is an introduction into the quality world. It will
answer basic questions such as, "What is quality?", "What
does it include?", "Why is it needed?", "Who has a quality
function?", "Where is it located in the organization?" It
will present the main components of a quality management system and will
locate activities such as audits, policy deployment, certification, ISO
9000 and other standards as part of the system. It will also describe existing
tools and methodologies, their benefits and limitations, and how to use
each of them.
Benefits
At the end of this course, you will have a global vision of quality and
its components, making communication with quality organizations easier.
You will be able to become an active member or leader in the promotion and
implementation of a quality culture and associated methods in your organization.
Your contribution will help to improve efficiency of activities in your
area.
1.2.2 - Wafer level Reliability
Program focus
This six-hour course presents the main intrinsic failure modes in modern
IC’s manufactured using deep submicron technologies. After reviewing
the main reliability concept basics in ICs, the main IC failure modes are
presented, giving the phenomenological and physical description of their
occurrence, their characteristics, the associated reliability modeling and
the experimental methodologies used in the Research & Development and
the manufacturing contexts
Benefits
At the end of this course, you will be able to :
- interpret the reliability physics which drives the occurrence and acceleration of the main intrinsic failure modes limiting the IC life
- figure out the consequences of the associated wear-out phenomena on the device and product performances and functionality.
- Conduct characterization tests and analyse the associated results for a process or design reliability assessment
1.2.3 - Device & Oxide Reliability
Program focus
This six-hour course presents the challenges of device reliability with
scaling down CMOS and Non- Volatile Memory (NVM) technologies. Current experimental
techniques are given to analyze device reliability with regards to localized
and uniform Hot-Carrier injections, device lifetime determination and quasi-static
extrapolation to some simple digital circuits including inverters, ring
oscillators and pass gates in SRAM cells, EEPROMs and flash memory cells.
Some actual solutions are discussed.
Benefits
At the end of this course, you will be able to analyze device reliability
in MOSFET's and NVM using actual useful experimental techniques to evaluate
the Hot-Carrier injection efficiency in different MOS devices. You will
be able to use this course as a professional guide for process and device
reliability assessment engineers, including the latest developments in Hot-Carrier
degradation modeling and reliability design issues.
1.2.4 - Product Reliability
Program focus
This 6 hours course will present the major failure mechanisms of semiconductors,
excluding the ones already described in the previous courses. For each of
these major failure mechanisms the course will describe the failure mode
(physical signature), acceleration factors when known, detection methods,
and prevention proposals. Assembly level reliability tests performed to
accelerate the failure process (when applicable) and typical ALR test conditions
required by International Standards are also presented.
Benefits
At the end of this course, you will have a general vision of Assembly Level
Reliability testing and failures in the applications, and directions to
prevent them.
1.2.5 - Failure Mode & Effect Analysis
Program focus
This three-hour course explains the FMEA as a proactive approach for prevention
and robustness and how to run on this methodology for highlighting potential
risks and their effects on the intermediate or final product or service.
Benefits
At the end of this course, you will be able to effectively take part in
an FMEA and become the leader of this preventive methodology.
1.2.6 -Project Management Orientation
Program focus
This 9-hour course covers the project mode, work packages and project leader
progress reporting.
Benefits
At the end of this course, you will recognize the project mode and know
how to estimate the assigned work packages, how to report progress to the
project leader and how the project leader reports progress.
1.2.7 - Problem Solving Methods
Program focus
This six-hour course positions the problem solving method process in the
quality strategy, explains the application criteria, describes the eight
disciplines of the problem solving process and identifies process tools
to be used at different steps.
Benefits
At the end of this course, you will be able to apply a problem solving method.