Master in Microelectronics Technology and Manufacturing Management
Module 2.2 - Silicon Material
Detail
2.2.1 - Preparation of Silicon
2.2.3 - Nucleation, Growth & Epitaxy
2.2.1 - Preparation of Silicon
Program focus
This 6 hour course on Silicon Manufacturing for the Semiconductor industry
provides an overview of the steps needed to produce a substrate for nanotechnologies.
The course covers the main steps of silicon wafer production and outlines
the main challenges of the key processes. The key silicon parameters are
identified and their interaction with the various device processes is discussed
Benefits
The course will allow you to identify the key silicon wafer parameters that
must be specified for the main semiconductor applications and will be of
help in assessing the silicon contribution to common device failure modes
2.2.2 - SOI Technologies
Program focus
This 3 hours training course reviews the properties and benefits of advanced
substrates used for semiconductor industry such as Silicon On Insulator
(SOI) and Strained structures. Behaviour of SOI transistor and IC applications
are described. SOI manufacturing processes are listed and Smartcut process
is detailed. Key properties of SOI material, the metrology associated and
the capabilities of current mainstream SOI are shown. Advanced substrates
using strain are improving mobility: uniaxial strain and biaxial strain
substrates like SGOI or sSOI are reviewed.
Benefits
At the end of this course you will understand the main differences between
SOI and bulk transistors; you will understand which property brought by
SOI is used for what semiconductor application.
You will understand the basics of Smartcut layer transfer used for
SOI, SGOI ans sSOI products.
You will also understand that bulk and SOI materials have similar maturity
level in term of quality and manufacturing.
2.2.3 - Nucleation, Growth & Epitaxy
Program focus
The quantitative understanding of nucleation and growth is currently advancing
very rapidly and is by no means complete. This 6-hour course will focus
on chemical vapor deposition and molecular beam epitaxy systems in conjunction
with in-growth characterization techniques. After the theoretical overview
of thin films nucleation, deposition and growth, the applications of these
techniques for the realization of Epitaxial systems will be given.
Benefits
At the end of this course, you will gain insight on the revolutionary advances
in semiconductor technology and the spectacular growth of microelectronics
industry in the last decades due to a large extent on improvements of semiconductor
materials quality, which were made possible by the development of new deposition
techniques. The basic understanding of the growth deposition processes is
key basic knowledge to posses in microelectronics technology.
2.2.4 - Microstructure, Texture & Stress
Program focus
This 6-hour course gives basic knowledge on how the microstructure and stress
in thin films and patterned structures is related to deposition conditions,
geometry and post-processing.
Benefits
At the end of this course, you will understand how the stress state in an
integrated circuit is a function of the different fabrication steps (materials,
deposition methods, annealing, …). This knowledge is a key factor
in controlling the consequences of stress in devices (wafer bowing, hillocking,
….) or beneficial (mobility enhancement via strain engineering).